Patent Assignment
Reel/Frame 014954/0610
Assignment of Assignor's Interest
Recorded: 2004-02-06
Pages: 3
Assignor
LEE, JU-IL
Executed: 2004-01-16
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI BUBAL-EUB ICHON-SHI, KYOUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Cmos Image Sensor Using Spacer Etching Barrier Film
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest
Jun 5, 2014
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES FUND 99 LLC
Reel/Frame 033039/0775 →
Assignment of Assignor's Interest
Apr 28, 2017
From: INTELLECTUAL VENTURES FUND 99 LLC
To: TARSIUM B.V.
Reel/Frame 042172/0466 →
Nunc Pro Tunc Assignment
Apr 28, 2017
From: TARSIUM B.V.
To: ASML NETHERLANDS B.V.; CARL ZEISS SMT GMBH
Reel/Frame 042172/0767 →
Nunc Pro Tunc Assignment
May 9, 2017
From: CARL ZEISS SMT GMBH
To: CARL ZEISS AG
Reel/Frame 042307/0072 →