Patent Assignment
Reel/Frame 014974/0620
Assignment of Assignor's Interest
Recorded: 2004-02-06
Pages: 3
Assignor
CHO, CHANG-HO
Executed: 2003-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Mold Die for Molding Chip Array, Molding Equipment Including the Same, and Method for Molding Chip Array