IP Library › Assignment 014977/0198
Patent Assignment
Reel/Frame 014977/0198

Assignment of Assignor's Interest

Recorded: 2004-08-12 Pages: 3
Assignors
KAO, JEN-CHIEH
Executed: 2004-07-08
YEE, KUO-CHUNG
Executed: 2004-07-08
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD. RD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property (1)
[Mold and Method of Molding Semiconductor Devices]
Patent: 7,247,267 →
Application: 10/710,906 →
Publication: US 2005/0037104