IP Library › Assignment 014982/0031
Patent Assignment
Reel/Frame 014982/0031

Assignment of Assignor's Interest

Recorded: 2004-02-17 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2004-02-02
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Solder Foil, Semiconductor Device and Electronic Device
Patent: 7,722,962 →
Application: 10/451,610 →
Publication: US 2006/0061974
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2004
From: SOGA, TASAO; HATA, HANAE; ISHIDA, TOSHIHARU; NAKATSUKA, TETSUYA
To: HITACHI, LTD.
Reel/Frame 015248/0612 →
Merger and Change of Name May 11, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026259/0724 →