IP Library › Assignment 015248/0612
Patent Assignment
Reel/Frame 015248/0612

Assignment of Assignor's Interest

Recorded: 2004-03-31 Pages: 2
Assignors
SOGA, TASAO
Executed: 2004-01-27
HATA, HANAE
Executed: 2004-01-30
ISHIDA, TOSHIHARU
Executed: 2004-02-09
NAKATSUKA, TETSUYA
Executed: 2004-02-12
OKAMOTO, MASAHIDE
Executed: 2004-02-20
MIURA, KAZUMA
Executed: 2004-02-20
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Solder Foil, Semiconductor Device and Electronic Device
Patent: 7,722,962 →
Application: 10/451,610 →
Publication: US 2006/0061974
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 17, 2004
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014982/0031 →
Merger and Change of Name May 11, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026259/0724 →