Patent Assignment
Reel/Frame 014990/0037
Assignment of Assignor's Interest
Recorded: 2004-02-19
Received: 2004-02-24
Pages: 5
Assignor
FLIP CHIP TECHNOLOGIES, LLC
Executed: 2004-02-06
Assignee
FLIPCHIP INTERNATIONAL, LLC
2448 NORTH ROSE STREET, MESA, AZ, 85213, UNITED STATES
Covered Properties
(2)
Method for Forming Chip Scale Package
Application:
09/885,846 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Application:
09/766,798 →