IP Library › Patent Application 09885846
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App. No. 09/885,846 · Confirmation No. 6795

METHOD FOR FORMING CHIP SCALE PACKAGE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2004-05-03 IFEE Issue Fee Payment (PTO-85B) 2 View
2001-06-20 TRNA Transmittal of New Application 3 View
2001-06-20 A.PE Preliminary Amendment 6 View
2001-06-20 SPEC Specification 15 View
2001-06-20 CLM Claims 5 View
2001-06-20 ABST Abstract 1 View
2001-06-20 DRW Drawings-only black and white line drawings 2 View
2001-06-20 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
09/885,846
Filed
2001-06-20
Granted
2004-06-15
Pub. No.
US20010031548A1
Art Unit
2813
PTA
-219 days