Patent Assignment
Reel/Frame 055292/0898
Release of Security Interest
Recorded: 2021-02-17
Pages: 7
Assignor
WELLS FARGO BANK, NATIONAL ASSOCIATION
Executed: 2021-02-15
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Properties
(20)
Methods and Structures for a Vertical Pillar Interconnect
PCT:
PCT/US2010/040410 ↗
Chip Scale Package Using Large Ductile Solder Balls
Method for Forming Chip Scale Package
Patent:
6,287,893 →
Application:
09/114,204 →
Solder Bar for High Power Flip Chips
Patent:
7,057,292 →
Application:
09/575,298 →
Polymer Collar for Solder Bumps
Patent:
6,578,755 →
Application:
09/668,450 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Method for Forming Chip Scale Package
Wafer-Level Moat Structures
Forming Partial-Depth Features in Polymer Film
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications
Application:
11/609,036 →
Publication:
US 2008/0136019
Semiconductor Device Package with Bump Overlying a Polymer Layer
Application:
11/718,192 →
Publication:
US 2009/0014869
Wafer-Level Interconnect for High Mechanical Reliability Applications
Solder Bump Interconnect for Improved Mechanical and Thermo-Mechanical Performance
Under Bump Metallization Structure Having a Seed Layer for Electroless Nickel Deposition
Application:
12/142,415 →
Publication:
US 2009/0057909
Enhanced Reliability for Semiconductor Devices Using Dielectric Encasement
Methods and Structures for a Vertical Pillar Interconnect
Application:
12/828,003 →
Publication:
US 2011/0003470
Solder Bump Interconnect
Thin Film Structure For High Density Inductors and Redistribution in Wafer Level Packaging
Application:
61/522,628 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.