Enhanced reliability for semiconductor devices using dielectric encasement
View Patent ↗A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal.
1. A method for a semiconductor device using dielectric encasement, the semiconductor device comprising a substrate layer, a passivation layer overlying the substrate layer, and a plurality of under bump metallurgies (UBMs), each UBM extending onto a top surface of the passivation layer, the method comprising:
forming a photoimageable permanent dielectric layer overlying the passivation layer;
patterning the dielectric layer to form a plurality of openings in the dielectric layer, each opening positioned over a respective one of the UBMs, and each opening having a sidewall;
adding fluxing material into each of the plurality of openings;
applying solder to a respective top surface of the fluxing material in each of the openings; and
heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to and fully cover the respective sidewall of each opening.
2. The method of claim 1 , wherein the forming the dielectric layer comprises using a liquid dielectric.
3. The method of claim 1 , wherein the forming the dielectric layer comprises using a dry film laminate.
4. The method of claim 1 , wherein the dielectric layer has a thickness of 1-300 micrometers.
5. The method of claim 1 , wherein the semiconductor device further comprises an input/output pad positioned on the substrate layer under one of the UBMs.
6. The method of claim 1 , wherein after the patterning, the dielectric layer overlaps each of the UBMs by at least 1 micron.
7. The method of claim 1 , wherein the semiconductor device the substrate layer comprises silicon.
8. The method of claim 1 , wherein the solder is at least one solder sphere.
9. The method of claim 1 , wherein the solder is a solder paste.
10. The method of claim 1 , wherein after the heating, the solder forms a protective seal.
11. The method of claim 1 , wherein after the heating, the solder completely fills each of the openings.
12. The method of claim 1 , wherein the solder is a plurality of solder spheres, and after the heating, an outer surface of each solder sphere extends outward laterally beyond an edge of its respective opening.
13. The method of claim 1 , wherein the solder contains no flux.
14. The method of claim 1 , wherein the adding fluxing material comprises dispensing or stencil printing the fluxing material.
15. A method for a semiconductor device using dielectric encasement, the semiconductor device comprising a substrate layer, a passivation layer overlying the substrate layer, and a plurality of under bump metallurgies (UBMs), each UBM extending onto a top surface of the passivation layer, the method comprising:
applying a layer of a photoimageable permanent dielectric material overlying the passivation layer;
patterning the layer of the photoimageable permanent dielectric material to have a plurality of openings, each opening exposing a portion of a respective input/output pad;
applying solder, containing flux, into each of the plurality of openings; and
heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to a respective sidewall of each of the openings and further to completely fill each of the openings.
16. The method of claim 15 , wherein the layer of the photoimageable permanent dielectric material is a liquid dielectric.
17. The method of claim 15 , wherein the layer of the photoimageable permanent dielectric material is a dry film laminate.
18. The method of claim 15 , wherein the layer of the photoimageable permanent dielectric material has a thickness of 1-300 micrometers.
19. The method of claim 15 , wherein after the heating, the solder forms a protective seal.
20. The method of claim 15 , wherein the solder is a plurality of solder spheres, and after the heating, an outer surface of each solder sphere extends outward laterally beyond an edge of its respective opening.