Patent Assignment
Reel/Frame 027212/0515
Security Agreement
Recorded: 2011-11-10
Received: 2011-11-10
Pages: 32
Assignor
FLIPCHIP INTERNATIONAL, LLC
Executed: 2011-10-24
Assignee
WELLS FARGO BANK, NATIONAL ASSOCIATION
100 WEST WASHINGTON STREET, 15TH FLOOR, WELLS FARGO PLAZA, MAC S4101-158, PHOENIX, AZ, 85003, UNITED STATES
Covered Properties
(18)
System for Opening a Medical Blister Package
Application:
13/634,814 →
Optical Switch
Application:
13/267,787 →
Thin Film Structure For High Density Inductors and Redistribution in Wafer Level Packaging
Application:
61/522,628 →
Solder Bump Interconnect
Application:
13/085,759 →
Methods and Structures for a Vertical Pillar Interconnect
Application:
12/828,003 →
PCT:
PCTUS2010040410 ↗
Enhanced Reliability for Semiconductor Devices Using Dielectric Encasement
Application:
12/537,236 →
Under Bump Metallization Structure Having a Seed Layer for Electroless Nickel Deposition
Application:
12/142,415 →
Solder Bump Interconnect for Improved Mechanical and Thermo-Mechanical Performance
Application:
12/107,009 →
Semiconductor Device Package with Bump Overlying a Polymer Layer
Application:
11/718,192 →
Wafer-Level Interconnect for High Mechanical Reliability Applications
Application:
11/867,646 →
Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications
Application:
11/609,036 →
Transdermal Granisetron
Application:
10/544,259 →
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Application:
11/145,948 →
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Application:
10/704,131 →
Forming Partial-Depth Features in Polymer Film
Application:
10/672,201 →
Wafer-Level Moat Structures
Application:
10/672,165 →
Method for Forming Chip Scale Package
Application:
09/885,846 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Application:
09/766,798 →