IP Library › Patent Application 11609036
Couldn't load this record The USPTO API returned an error (HTTP 429) — please try again shortly.
Patent Application Utility
App. No. 11/609,036 · Confirmation No. 1436

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Abandoned -- Failure to Respond to an Office Action View Publication ↗
No downloadable documents found — record may not be publicly available.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
11/609,036
Filed
2006-12-11
Pub. No.
US20080136019A1
Art Unit
2826