Patent Assignment
Reel/Frame 019924/0897
Assignment of Assignor's Interest
Recorded: 2007-10-05
Received: 2007-10-05
Pages: 4
Assignors
VRTIS, JOAN
Executed: 2007-09-17
JOHNSON, MICHAEL E.
Executed: 2007-09-24
STROTHMANN, THOMAS
Executed: 2007-09-28
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, AZ, 85034, UNITED STATES
Covered Property
(1)
Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications
Application:
11/609,036 →