IP Library Assignment 019924/0897
Patent Assignment
Reel/Frame 019924/0897

Assignment of Assignor's Interest

Recorded: 2007-10-05 Received: 2007-10-05 Pages: 4
Assignors
VRTIS, JOAN
Executed: 2007-09-17
JOHNSON, MICHAEL E.
Executed: 2007-09-24
STROTHMANN, THOMAS
Executed: 2007-09-28
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, AZ, 85034, UNITED STATES
Covered Property (1)
Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications
Application: 11/609,036 →