IP Library › Patent Application 61522628
Patent Application Provisional
App. No. 61/522,628 · Confirmation No. 7664

Thin Film Structure For High Density Inductors and Redistribution in Wafer Level Packaging

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2011-08-23 APP.FILE.REC Filing Receipt 3 View
2011-08-11 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-08-11 SPEC Specification 5 View
2011-08-11 CLM Claims 1 View
2011-08-11 DRW.NONBW Drawings-other than black and white line drawings 5 View
2011-08-11 WFEE Fee Worksheet (SB06) 2 View
2011-08-11 N417 Electronic Filing System Acknowledgment Receipt 3 View
2011-08-11 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/522,628
Filed
2011-08-11