IP Library Assignment 023365/0570
Patent Assignment
Reel/Frame 023365/0570

Assignment of Assignor's Interest

Recorded: 2009-10-13 Pages: 8
Assignors
RECHE, JOHN J.H.
Executed: 2009-09-08
JOHNSON, MICHAEL E.
Executed: 2009-09-08
BURGESS, GUY F.
Executed: 2009-09-08
CURTIS, ANTHONY P.
Executed: 2009-09-11
LICHTENTHAL, STUART
Executed: 2009-09-10
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property (1)
Enhanced Reliability for Semiconductor Devices Using Dielectric Encasement
Patent: 8,058,163 →
Application: 12/537,236 →
Publication: US 2010/0032836
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →
Assignment of Assignor's Interest Jun 17, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 056612/0882 →