Patent Assignment
Reel/Frame 056612/0882
Assignment of Assignor's Interest
Recorded: 2021-06-17
Pages: 3
Assignor
FLIPCHIP INTERNATIONAL, LLC
Executed: 2021-05-17
Assignee
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE, KUNSHAN, JIANGSU, 215300, CHINA
Covered Properties
(4)
Wafer-Level Interconnect for High Mechanical Reliability Applications
Solder Bump Interconnect for Improved Mechanical and Thermo-Mechanical Performance
Enhanced Reliability for Semiconductor Devices Using Dielectric Encasement
Solder Bump Interconnect
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.