Granted Patent
Utility
US 6,750,135 · App. 09/885,846
Method for forming chip scale package
Inventors:
Peter Elenius, Harry Hollack
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: Jun 20, 2001
Inventors
Peter Elenius
Harry Hollack
Assignee (at issue)
Flip Chip Technologies, L.L.C.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.