Security Agreement

Recorded: 2004-03-01 Received: 2004-03-03 Pages: 4

Assignor

FLIPCHIP INTERNATIONAL LLC

Executed: 2004-02-06

Assignee

KULICKE & SOFFA INDUSTRIES, INC.

2101 BLAIR ROAD ROAD, WILLOW GROVE, PA, 19090, UNITED STATES

Covered Properties (2)

Method for Forming Chip Scale Package

Application: 09/885,846 →

Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor

Application: 09/766,798 →