Patent Assignment
Reel/Frame 016630/0226
Release of Security Interest
Recorded: 2005-10-10
Received: 2005-10-10
Pages: 6
Assignor
KULICKE AND SOFFA INDUSTRIES, INC.
Executed: 2005-09-09
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, AZ, 85034, UNITED STATES
Covered Properties
(7)
Heat Exchanger Package with Split Radiator and Split Charge Air Cooler
Application:
10/936,331 →
Heat Exchanger Package with Split Charge Air Cooler
Application:
10/723,879 →
Heat Exchanger Package with Split Radiator and Split Charge Air Cooler
Application:
10/723,881 →
Heat Exchanger Package
Application:
10/289,513 →
Hinged Electronic Watch
Application:
10/031,649 →
Method for Forming Chip Scale Package
Application:
09/885,846 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Application:
09/766,798 →