Patent Assignment
Reel/Frame 015293/0274
Change of Address
Recorded: 2004-10-27
Received: 2004-10-27
Pages: 3
Assignor
FLIPCHIP INTERNATIONAL, LLC
Executed: 2004-01-01
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DR., PHOENIX, AZ, 85034, UNITED STATES
Covered Properties
(2)
Method for Forming Chip Scale Package
Application:
09/885,846 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Application:
09/766,798 →