Ack of Intel. Prop. Collateral Lien

Recorded: 2005-11-08 Received: 2005-11-14 Pages: 15

Assignor

FLIPCHIP INTERNATIONAL, LLC

Executed: 2005-10-13

Assignee

CAPITALSOURCE FINANCE LLC

4445 WILLARD AVENUE, 12TH FLOOR, ATTN: STEVEN FREISHTAT, CHEVY CHASE, MD, 20815, UNITED STATES

Covered Properties (10)

Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing

Application: 11/145,948 →

High performance chip scale package for radio frequency devices

Application: 60/623,200 →

Forming Partial-Depth Features in Polymer Film

Application: 10/672,201 →

Wafer-Level Moat Structures

Application: 10/672,165 →

Solder Process and Solder Alloy Therefor

Application: 10/379,753 →

Lead-Based Solder Alloys Containing Copper

Application: 10/226,370 →

Welding Machine and Welding Method for Energy Welding of Cylinder Members

Application: 10/081,239 →

Solder Process and Solder Alloy Therefor

Application: 10/075,979 →

Method for Forming Chip Scale Package

Application: 09/885,846 →

Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor

Application: 09/766,798 →