Granted Patent
Utility
US 6,570,260
· Confirmation No. 9217
SOLDER PROCESS AND SOLDER ALLOY THEREFOR
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-02-15 | TRNA |
Transmittal of New Application | 2 | View | |
| 2002-02-15 | SPEC |
Specification | 12 | View | |
| 2002-02-15 | CLM |
Claims | 5 | View | |
| 2002-02-15 | ABST |
Abstract | 1 | View | |
| 2002-02-15 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2002-02-15 | OATH |
Oath or Declaration filed | 2 | View | |
| 2002-02-15 | LET. |
Miscellaneous Incoming Letter | 1 | View |
Inventors
Classification
USPC
257/778
H10W72/20
B23K35/26
H10W72/90
H10W72/251
B23K35/262
B23K35/268
Prosecution
- Examiner
- NHU, DAVID
- Art Unit
- 2818
- Docket No.
- DP-301915
- Confirmation No.
- 9217
Patent Term Adjustment
0days
RELEASE OF SECURITY INTEREST
Recorded 2011-01-05
RELEASE OF SECURITY INTEREST
Recorded 2009-08-26
ACK OF INTEL. PROP. COLLATERAL LIEN
Recorded 2005-11-08
ACK OF INTEL. PROP. COLLATERAL LIEN
Recorded 2005-11-01
SECURITY INTEREST IN LICENSED PATENTS
Recorded 2005-10-13
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-02-15
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Quick Facts
- Patent No.
- US 6,570,260
- App. No.
- 10/075,979
- Filed
- 2002-02-15
- Granted
- 2003-05-27
- Examiner
- NHU, DAVID
- Art Unit
- 2818
- PTA
- 0 days
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