Release of Security Interest

Recorded: 2009-08-26 Received: 2009-08-26 Pages: 12

Assignor

CAPITALSOURCE FINANCE LLC

Executed: 2009-08-21

Assignee

FLIPCHIP INTERNATIONAL LLC

3701 E. UNIVERSITY DRIVE, PHOENIX, AZ, 85034, UNITED STATES

Covered Properties (10)

Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing

Application: 11/145,948 →

High performance chip scale package for radio frequency devices

Application: 60/623,200 →

Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing

Application: 10/704,131 →

Forming Partial-Depth Features in Polymer Film

Application: 10/672,201 →

Wafer-Level Moat Structures

Application: 10/672,165 →

Solder Process and Solder Alloy Therefor

Application: 10/379,753 →

Lead-Based Solder Alloys Containing Copper

Application: 10/226,370 →

Solder Process and Solder Alloy Therefor

Application: 10/075,979 →

Method for Forming Chip Scale Package

Application: 09/885,846 →

Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor

Application: 09/766,798 →