Ack of Intel. Prop. Collateral Lien

Recorded: 2005-11-01 Received: 2005-11-14 Pages: 15

Assignor

FLIPCHIP INTERNATIONAL, LLC

Executed: 2005-10-13

Assignee

CAPITALSOURCE FINANCE LLC

4445 WILLARD AVENUE, 12TH FLOOR, CHEVY CHASE, MD, 20815, UNITED STATES

Covered Properties (11)

Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing

Application: 11/145,948 →

High performance chip scale package for radio frequency devices

Application: 60/623,200 →

Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing

Application: 10/704,131 →

Wafer-Level Moat Structures

Application: 10/672,165 →

Multizone Clamping System for Paint Mixer

Application: 10/672,001 →

Solder Process and Solder Alloy Therefor

Application: 10/379,753 →

Garden Shovel

Application: 29/171,957 →

Lead-Based Solder Alloys Containing Copper

Application: 10/226,370 →

Solder Process and Solder Alloy Therefor

Application: 10/075,979 →

Method for Forming Chip Scale Package

Application: 09/885,846 →

Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor

Application: 09/766,798 →