Assignment of Assignor's Interest

Recorded: 2011-04-26 Received: 2011-04-26 Pages: 5

Assignor

DELPHI TECHNOLOGIES, INC.

Executed: 2011-03-29

Assignee

APPLE INC.

1 INFINITE LOOP, CUPERTINO, CA, 95014, UNITED STATES

Covered Properties (7)

Method of Making an Electronic Assembly

Application: 11/190,130 →

Method of Attaching a Flip Chip Device and Circuit Assembly Formed Thereby

Application: 10/908,162 →

Relaxed Tolerance Flip Chip Assembly

Application: 10/955,706 →

Relaxed Tolerance Flip Chip Assembly

Application: 10/461,577 →

Flip-Chip Interconnect with Increased Current-Carrying Capability

Application: 10/461,318 →

Solder Process and Solder Alloy Therefor

Application: 10/379,753 →

Solder Process and Solder Alloy Therefor

Application: 10/075,979 →