IP Library › Assignment 016630/0850
Patent Assignment
Reel/Frame 016630/0850

Security Agreement

Recorded: 2005-10-13 Received: 2005-10-13 Pages: 17
Assignor
FLIPCHIP INTERNATIONAL, LLC
Executed: 2005-10-12
Assignee
WELLS FARGO BANK, NATIONAL ASSOCIATION
100 WASHINGTON STREET, 15TH FLOOR, WELLS FARGO PLAZA, MACS S4101-158, PHOENIX, AZ, 85003, UNITED STATES
Covered Properties (10)
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Application: 11/145,948 →
Mug
Application: 29/217,327 →
High performance chip scale package for radio frequency devices
Application: 60/623,200 →
Wafer-Level Moat Structures
Forming Partial-Depth Features in Polymer Film
Build-Up Structures with Multi-Angle Vias for Chip to Chip Interconnects and Optical Bussing
Application: 10/704,131 →
Forming Partial-Depth Features in Polymer Film
Application: 10/672,201 →
Wafer-Level Moat Structures
Application: 10/672,165 →
Method for Forming Chip Scale Package
Application: 09/885,846 →
Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor
Application: 09/766,798 →