Patent Assignment
Reel/Frame 020930/0057
Amended and Restated License Agreement
Recorded: 2008-05-08
Pages: 14
Assignor
FLIPCHIP INTERNATIONAL LLC
Executed: 2008-03-10
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD ROAD 811, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Properties
(11)
Solderable Contacts for Flip Chip Integrated Circuit Devices
Patent:
5,547,740 →
Application:
08/408,792 →
Solder Bump Transfer Device for Flip Chip Integrated Circuit Devices
Patent:
5,607,099 →
Application:
08/426,861 →
No Coat Backside Wafer Grinding Process
Patent:
5,632,667 →
Application:
08/496,333 →
Composite Solder Paste for Flip Chip Bumping
Patent:
5,803,340 →
Application:
08/536,592 →
Chip Scale Package Using Large Ductile Solder Balls
Method for Forming Chip Scale Package
Patent:
6,287,893 →
Application:
09/114,204 →
Solder Bar for High Power Flip Chips
Patent:
7,057,292 →
Application:
09/575,298 →
Polymer Collar for Solder Bumps
Patent:
6,578,755 →
Application:
09/668,450 →
Method for Forming Chip Scale Package
Wafer-Level Moat Structures
Forming Partial-Depth Features in Polymer Film
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 1995
From: HIGDON, WILLIAM DAVID; MACK, SUSAN ACHESON; CORNELL, RALPH EDWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007423/0037 →
Assignment of Assignor's Interest
Apr 24, 1995
From: YEH, SHING; HIGDON, WILLIAM DAVID; CORNELL, RALPH EDWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007475/0856 →
Assignment of Assignor's Interest
Aug 29, 1995
From: EARL, MICHAEL RAYMOND; DETTERICH, RUSSELL A.; YANCEY, ROBERT A.
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007606/0032 →
Assignment of Assignor's Interest
Sep 29, 1995
From: YEH, SHING; CARTER, BRADLEY HOWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007697/0945 →
Assignment of Assignor's Interest
Oct 20, 1997
From: ELENIUS, PETER; HOLLACK, HARRY
To: FLIP CHIP TECHNOLOGIES, L.L.C.
Reel/Frame 008862/0068 →
Assignment of Assignor's Interest
May 19, 2000
From: ELENIUS, PETER; YANG, HONG
To: FLIP CHIP TECHNOLOGIES, L.L.C.
Reel/Frame 010816/0537 →
Assignment of Assignor's Interest
Sep 22, 2000
From: ELENIUS, PETER; KIM, DEOK-HOON
To: FLIP CHIP TECHNOLOGIES, L.L.C.
Reel/Frame 011139/0240 →
Assignment of Assignor's Interest
Sep 26, 2003
From: ELENIUS, PETER; JOHNSON, MICHAEL E.
To: FLIP CHIP TECHNOLOGIES, L.L.C.
Reel/Frame 014553/0332 →
Assignment of Assignor's Interest
Sep 26, 2003
From: JOHNSON, MICHAEL E.; ELENIUS, PETER; KIM, DEOK HOON
To: FLIP CHIP TECHNOLOGIES, L.L.C.
Reel/Frame 014551/0379 →
Assignment of Assignor's Interest
Feb 19, 2004
From: FLIP CHIP TECHNOLOGIES, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 014990/0037 →
Security Agreement
Mar 1, 2004
From: FLIPCHIP INTERNATIONAL LLC
To: KULICKE & SOFFA INDUSTRIES, INC.
Reel/Frame 015017/0171 →
Change of Address
Oct 27, 2004
From: FLIPCHIP INTERNATIONAL, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 015293/0274 →
Assignment of Assignor's Interest
Dec 13, 2004
From: FLIP CHIP TECHNOLOGIES, L.L.C.
To: FLIPCHIP INTERNATIONAL, L.L.C.
Reel/Frame 015453/0851 →
Assignment of Assignor's Interest
Feb 4, 2005
From: FLIP CHIP TECHNOLOGIES, L.L.C.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 015657/0197 →
Assignment of Assignor's Interest
Jul 5, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 016700/0623 →
Security Agreement
Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Release of Security Interest
Oct 10, 2005
From: KULICKE AND SOFFA INDUSTRIES, INC.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 016630/0226 →
Security Interest in Licensed Patents
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0909 →
Security Agreement
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0850 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Release of Security Agreement
Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Assignment of Assignor's Interest
Apr 23, 2012
From: DELPHI TECHNOLOGIES, INC.
To: FLIPCHIP INTERNATIONAL
Reel/Frame 028088/0207 →