Patent Assignment
Reel/Frame 007475/0856
Assignment of Assignor's Interest
Recorded: 1995-04-24
Pages: 3
Assignors
YEH, SHING
Executed: 1995-04-07
HIGDON, WILLIAM DAVID
Executed: 1995-04-06
CORNELL, RALPH EDWARD
Executed: 1995-04-07
Assignee
DELCO ELECTRONICS CORPORATION
ERC BUILDING - MAIL STOP D-32, KOKOMO, INDIANA, 46904
Covered Property
(1)
Solder Bump Transfer Device for Flip Chip Integrated Circuit Devices
Patent:
5,607,099 →
Application:
08/426,861 →
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 5, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 016700/0623 →
Security Agreement
Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Security Interest in Licensed Patents
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0909 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Release of Security Agreement
Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Amended and Restated License Agreement
May 8, 2008
From: FLIPCHIP INTERNATIONAL LLC
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 020930/0057 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Assignment of Assignor's Interest
Apr 23, 2012
From: DELPHI TECHNOLOGIES, INC.
To: FLIPCHIP INTERNATIONAL
Reel/Frame 028088/0207 →