Patent Assignment
Reel/Frame 028088/0207
Assignment of Assignor's Interest
Recorded: 2012-04-23
Pages: 4
Assignor
DELPHI TECHNOLOGIES, INC.
Executed: 2012-04-10
Assignee
FLIPCHIP INTERNATIONAL
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Properties
(8)
Solderable Contacts for Flip Chip Integrated Circuit Devices
Patent:
5,547,740 →
Application:
08/408,792 →
Solder Bump Transfer Device for Flip Chip Integrated Circuit Devices
Patent:
5,607,099 →
Application:
08/426,861 →
No Coat Backside Wafer Grinding Process
Patent:
5,632,667 →
Application:
08/496,333 →
Composite Solder Paste for Flip Chip Bumping
Patent:
5,803,340 →
Application:
08/536,592 →
Solder Bump Input/Output Pad for a Surface Mount Circuit Device
Patent:
6,184,581 →
Application:
08/977,525 →
Surface Mount Circuit Device and Solder Bumping Method Therefor
Patent:
6,251,501 →
Application:
09/280,946 →
Method of Solder Bumping a Circuit Component
Patent:
6,281,106 →
Application:
09/449,820 →
Surface Bumping Method and Structure Formed Thereby
Patent:
6,375,062 →
Application:
09/706,543 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 1995
From: HIGDON, WILLIAM DAVID; MACK, SUSAN ACHESON; CORNELL, RALPH EDWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007423/0037 →
Assignment of Assignor's Interest
Apr 24, 1995
From: YEH, SHING; HIGDON, WILLIAM DAVID; CORNELL, RALPH EDWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007475/0856 →
Assignment of Assignor's Interest
Aug 29, 1995
From: EARL, MICHAEL RAYMOND; DETTERICH, RUSSELL A.; YANCEY, ROBERT A.
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007606/0032 →
Assignment of Assignor's Interest
Sep 29, 1995
From: YEH, SHING; CARTER, BRADLEY HOWARD
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007697/0945 →
Confirmatory License
Oct 4, 1999
From: DELCO ELECTRONICS CORPORATION
To: UNITED STATES AIR FORCE
Reel/Frame 010301/0138 →
Assignment of Assignor's Interest
Jan 10, 2000
From: HIGDON, WILLIAM DAVID; STEPNIAK, FRANK; YEH, SHING
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 010558/0475 →
Assignment of Assignor's Interest
Apr 17, 2000
From: HIGDON, WILLIAM DAVID; YEH, SHING
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 010758/0321 →
Assignment of Assignor's Interest
Nov 1, 2000
From: HIGDON, WILLIAM D.; STEPNIAK, FRANK
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 011292/0272 →
Confirmatory License
Nov 1, 2002
From: FRED HUTCHINSON CANCER RESEARCH CENTER
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 013442/0017 →
Assignment of Assignor's Interest
Jul 5, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 016700/0623 →
Security Agreement
Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Assignment of Assignor's Interest
Sep 30, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES INC.
Reel/Frame 017115/0208 →
Security Interest in Licensed Patents
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0909 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Release of Security Agreement
Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Amended and Restated License Agreement
May 8, 2008
From: FLIPCHIP INTERNATIONAL LLC
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 020930/0057 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Assignment of Assignor's Interest
Oct 2, 2009
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023337/0262 →
Release of Security Interest
Jan 11, 2011
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 025621/0023 →
Assignment of Assignor's Interest
Oct 31, 2013
From: CORNELL, RALPH EDWARD; VAIDYANATHAN, APARNA; ERICKSON, CURT A
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 031529/0037 →