Patent Assignment
Reel/Frame 010558/0475
Assignment of Assignor's Interest
Recorded: 2000-01-10
Pages: 3
Assignors
HIGDON, WILLIAM DAVID
Executed: 1999-12-06
STEPNIAK, FRANK
Executed: 1999-12-06
YEH, SHING
Executed: 1999-11-30
Assignee
DELPHI TECHNOLOGIES, INC.
TROY, MICHIGAN
Covered Property
(1)
Method of Solder Bumping a Circuit Component
Patent:
6,281,106 →
Application:
09/449,820 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 30, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES INC.
Reel/Frame 017115/0208 →
Security Interest in Licensed Patents
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0909 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Assignment of Assignor's Interest
Apr 23, 2012
From: DELPHI TECHNOLOGIES, INC.
To: FLIPCHIP INTERNATIONAL
Reel/Frame 028088/0207 →