Patent Assignment
Reel/Frame 031529/0037
Assignment of Assignor's Interest
Recorded: 2013-10-31
Pages: 9
Assignors
CORNELL, RALPH EDWARD
Executed: 1996-10-21
VAIDYANATHAN, APARNA
Executed: 1996-12-06
ERICKSON, CURT A
Executed: 1996-10-02
Assignee
DELCO ELECTRONICS CORPORATION
700 EAST FIRMIN STREET, KOKOMO, INDIANA, 46902
Covered Property
(1)
Solder Bump Input/Output Pad for a Surface Mount Circuit Device
Patent:
6,184,581 →
Application:
08/977,525 →
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License
Oct 4, 1999
From: DELCO ELECTRONICS CORPORATION
To: UNITED STATES AIR FORCE
Reel/Frame 010301/0138 →
Security Interest in Licensed Patents
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0909 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Assignment of Assignor's Interest
Oct 2, 2009
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023337/0262 →
Release of Security Interest
Jan 11, 2011
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 025621/0023 →
Assignment of Assignor's Interest
Apr 23, 2012
From: DELPHI TECHNOLOGIES, INC.
To: FLIPCHIP INTERNATIONAL
Reel/Frame 028088/0207 →