IP Library › Assignment 016700/0623
Patent Assignment
Reel/Frame 016700/0623

Assignment of Assignor's Interest

Recorded: 2005-07-05 Pages: 6
Assignor
DELCO ELECTRONICS CORPORATION
Executed: 2005-07-01
Assignee
DELPHI TECHNOLOGIES, INC.
5725 DELPHI DRIVE, TROY, MICHIGAN, 48098
Covered Properties (125)
Post-Termination Apparatus and Process for Thick Film Resistors of Printed Circuit Boards
Patent: 5,169,679 →
Application: 07/256,017 →
Method of Achieving Selective Inhibition and Control of Adhesion in Thick-Film Conductors
Patent: 5,122,929 →
Application: 07/297,201 →
Process for Forming High and Low Voltage Cmos Transistors on a Single Integrated Circuit Chip
Patent: 5,047,358 →
Application: 07/324,869 →
Motor Vehicle Radio with an Automatic Volume Control Device
Patent: 5,027,432 →
Application: 07/349,628 →
Integrated Circuit Interconnect Having Dual Dielectric Intermediate Layer
Patent: 5,070,037 →
Application: 07/401,311 →
An Interface Device for Thermally Coupling an Integrated Circuit to a Heat Sink
Patent: 5,151,777 →
Application: 07/422,395 →
Method of Forming Semiconductor Stalk Structure by Epitaxial Growth in Trench
Patent: 5,034,342 →
Application: 07/546,289 →
Rearview Mirror Head-Up Display
Patent: 5,037,182 →
Application: 07/580,971 →
A Method of Manufacturing Cmos Integrated Circuit with Eeprom
Patent: 5,153,143 →
Application: 07/597,459 →
Low Noise Communication Bus Driver
Patent: 5,164,611 →
Application: 07/599,532 →
Post-Termination Apparatus and Process for Thick Film Resistors of Printed Circuit Boards
Patent: 5,164,698 →
Application: 07/724,011 →
Provision of Substrate Pillars to Maintain Chip Standoff
Patent: 5,220,200 →
Application: 07/734,706 →
Refractory Covercoat for Semiconductor Devices
Patent: 5,252,858 →
Application: 07/793,896 →
Thick Film Sense Resistor Composition and Method of Using the Same
Patent: 5,221,644 →
Application: 07/806,191 →
Noise Blanking Circuit for Am Stereo
Patent: 5,261,004 →
Application: 07/808,829 →
Method and Apparatus for Tuning and Aligning an Fm Receiver
Patent: 5,428,829 →
Application: 07/952,554 →
Stereo Detection and Audio Processing Apparatus
Patent: 5,341,431 →
Application: 07/954,721 →
Out-Of-Lock Detector for Synchronous Am Detection
Patent: 5,359,661 →
Application: 07/954,997 →
Measurement Circuit Utilizing a Low Tcr Thick Film Sense Resistor
Patent: 5,341,119 →
Application: 07/972,334 →
Thick Film Rotational Accelerometer Having Two Structurally Integrated Acceleration Sensors
Patent: 5,456,109 →
Application: 08/038,422 →
Method of Micromachining an Integrated Sensor on the Surface of a Silicon Wafer
Patent: 5,427,975 →
Application: 08/059,222 →
Multilayer Metallization for Silicon Semiconductor Devices Including a Diffusion Barrier Formed of Amorphous Tungsten/Silicon
Patent: 5,369,300 →
Application: 08/075,182 →
High Density Integrated Circuit with High Output Impedance
Patent: 5,337,021 →
Application: 08/075,941 →
Compact Liquid Crystal Display for Instrument Panel Having a Wrap Around Flexible Printed Circuit Board and Translucent Web
Patent: 5,450,221 →
Application: 08/117,813 →
High Power Semiconductor Switch Module
Patent: 5,563,447 →
Application: 08/117,924 →
Device and Method for Cd Shuffle Play
Patent: 5,408,448 →
Application: 08/133,351 →
Circuit Board Support
Patent: 5,445,450 →
Application: 08/133,923 →
Method for Forming Thick Film Resistors and Compositions Therefor
Patent: 5,463,367 →
Application: 08/136,058 →
Method of Bonding Silicon Wafers at Temperatures Below 500 Degrees Centigrade for Sensor Applications
Patent: 5,413,955 →
Application: 08/169,117 →
Method of Making and Sealing a Semiconductor Device Having an Air Path Therethrough
Patent: 5,369,057 →
Application: 08/169,118 →
Method for Hermetically Sealing a Single Layer Ceramic Thick Film Electronic Module
Patent: 5,475,567 →
Application: 08/169,237 →
Thick Film Hybrid Multilayer Circuit
Patent: 5,475,263 →
Application: 08/195,430 →
Method for Controlling Solder Bump Height for Flip Chip Integrated Circuit Devices
Patent: 5,400,950 →
Application: 08/199,869 →
Method for Applying Solder to a Fine Pitch Flip Chip Pattern
Patent: 5,482,200 →
Application: 08/200,038 →
Method of Preventing Aluminum Bond Pad Corrosion During Dicing of Integrated Circuit Wafers
Patent: 5,461,008 →
Application: 08/249,815 →
Retracting Head Up Display with Image Position Adjustment
Patent: 5,394,203 →
Application: 08/254,715 →
Head Up Display with Night Vision Enhancement
Patent: 5,414,439 →
Application: 08/257,310 →
Compensation for Ground Voltage Variation on a Communication Bus
Patent: 5,513,218 →
Application: 08/262,176 →
Interlocking Housing and Case Assembly Having a Circuit Board Disposed Parallel to a Front Panel
Patent: 5,475,566 →
Application: 08/262,182 →
Retracting Head Up Display with Fine Adjustment of Combiner
Patent: 5,457,575 →
Application: 08/262,425 →
Squeegee for Thick Film Screen Printing Processes
Patent: 5,448,948 →
Application: 08/279,776 →
Reduced Stress Terminal Pattern for Integrated Circuit Devices and Packages
Patent: 5,491,364 →
Application: 08/299,924 →
Diversity Receiver for Fm Stereo Utilizing a Pilot Tone Multiple for Phase Alignment of Received Signals
Patent: 5,517,686 →
Application: 08/314,123 →
Ink Composition for an Ultra-Thick Thick Film for Thermal Management of a Hybrid Circuit
Patent: 5,527,627 →
Application: 08/342,966 →
Method of Mounting Electronic Components on a Circuit Board
Patent: 5,491,890 →
Application: 08/353,746 →
Serial Communication Method and Apparatus
Patent: 5,701,330 →
Application: 08/357,893 →
Semiconductor Device Having Field Limiting Ring and a Process Therefor
Patent: 5,545,915 →
Application: 08/376,566 →
Solderable Contacts for Flip Chip Integrated Circuit Devices
Patent: 5,547,740 →
Application: 08/408,792 →
Parabolic Current Generator for Use with a Low Noise Communication Bus Driver
Patent: 5,530,388 →
Application: 08/409,249 →
Microprogrammed Timer Processor Having a Variable Loop Resolution Architecture
Patent: 5,664,167 →
Application: 08/411,370 →
Universal Audio Analyzer
Patent: 5,644,505 →
Application: 08/418,349 →
Programmable Transducer Amplifier Circuit
Patent: 5,534,816 →
Application: 08/421,956 →
Solder Bump Transfer Device for Flip Chip Integrated Circuit Devices
Patent: 5,607,099 →
Application: 08/426,861 →
Adaptive System for Determining Radio Frequency at Vehicle Start-Up
Patent: 5,734,971 →
Application: 08/441,109 →
Head Up Display with Incident Light Filter
Patent: 5,486,840 →
Application: 08/479,253 →
No Coat Backside Wafer Grinding Process
Patent: 5,632,667 →
Application: 08/496,333 →
Configurable Neural Network Integrated Circuit
Patent: 5,956,703 →
Application: 08/508,637 →
Integrated Printed Circuit Connector and Ground Clip Assembly
Patent: 5,603,620 →
Application: 08/511,423 →
Wheatstone Bridge Amplifier Circuit with Integrated Diagnostic Testing
Patent: 5,631,602 →
Application: 08/511,769 →
Silicon Flow Sensor
Patent: 5,663,508 →
Application: 08/512,250 →
Rapid Prototyping Process and Cooling Chamber Therefor
Patent: 5,622,577 →
Application: 08/520,115 →
Segmented Thick Film Resistors
Patent: 5,621,240 →
Application: 08/523,580 →
Composite Solder Paste for Flip Chip Bumping
Patent: 5,803,340 →
Application: 08/536,592 →
Flip-Chip Mounting Assembly and Method with Vertical Wafer Feeder
Patent: 5,671,530 →
Application: 08/550,262 →
All-Silicon Monolithic Motion Sensor with Integrated Conditioning Circuit
Patent: 5,721,162 →
Application: 08/552,401 →
Backlite Antenna for Am/Fm Automobile Radio Having Broadband Fm Reception
Patent: 5,610,619 →
Application: 08/560,157 →
Backlite Antenna for Am/Fm Automobile Radio
Patent: 5,790,079 →
Application: 08/561,644 →
One-Chip Integrated Sensor Process
Patent: 5,719,069 →
Application: 08/571,627 →
Pressure Sensor Apparatus with Integrated Circuit Mounted Thereon
Patent: 5,629,486 →
Application: 08/591,876 →
Method for Making Semiconductor Device Having Field Limiting Ring
Patent: 5,672,528 →
Application: 08/635,509 →
Integrated Pulse-Width Modulation Circuit with Thermal Shutdown Circuit
Patent: 5,675,297 →
Application: 08/639,389 →
Accurate Integrated Oscillator Circuit
Patent: 5,699,024 →
Application: 08/643,911 →
Binary Programmable Current Mirror
Patent: 5,608,348 →
Application: 08/651,440 →
Thick-Film Conductor Compositions Comprising Silver or Palladium Particles Coated with Alumina or Zirconia
Patent: 5,716,552 →
Application: 08/668,900 →
Method for Making an All-Silicon Capacitive Pressure Sensor
Patent: 5,706,565 →
Application: 08/707,107 →
Dual-Solder Process for Enhancing Reliability of Thick-Film Hybrid Circuits
Patent: 5,803,344 →
Application: 08/709,886 →
Method and Apparatus for Reducing Fm Intrusion in Am Receivers
Patent: 5,937,337 →
Application: 08/715,905 →
Electronic Circuit with Itegrated Terminal Pins
Patent: 5,774,342 →
Application: 08/721,396 →
Glass Patch Cellular Antenna
Patent: 5,714,959 →
Application: 08/725,836 →
Circuit Protection from Radio Frequency Energy
Patent: 6,011,698 →
Application: 08/748,223 →
Method of Protecting Silicon Wafers During Wet Chemical Etching
Patent: 5,879,572 →
Application: 08/751,350 →
Exterior Temperature Sensor on Antenna Finial
Patent: 5,813,765 →
Application: 08/783,842 →
High Speed Multimedia Data Network
Patent: 5,995,512 →
Application: 08/785,244 →
Silicon Micromachined Motion Sensor and Method of Making
Patent: 5,831,162 →
Application: 08/785,683 →
Dual Rate Communication Protocol
Patent: 5,954,775 →
Application: 08/795,999 →
Method of Inspecting Integrated Circuit Solder Joints with X-Ray Detectable Encapsulant
Patent: 5,891,754 →
Application: 08/798,260 →
Flip Chip-on-Flip Chip Multi-Chip Module
Patent: 5,770,477 →
Application: 08/798,457 →
Bracket for Supporting and Aligning a Circuit Component with Respect to a Circuit Board
Patent: 6,233,159 →
Application: 08/799,057 →
Rapid Prototyping Process and Apparatus Therefor
Patent: 5,846,370 →
Application: 08/819,643 →
Distributed Digital Signal Processing for Vehicle Audio Systems
Patent: 5,983,087 →
Application: 08/882,766 →
Process for Converting a Wire Bond Pad to a Flip Chip Solder Bump Pad and Pad Formed Thereby
Patent: 5,891,756 →
Application: 08/883,694 →
Method of Making a Insulated Gate Bipolar Transitor with High-Enegy P+ Implant and Silicon- Etch Contact
Patent: 5,910,668 →
Application: 08/909,436 →
All-Silicon Capacitive Pressure Sensor
Patent: 5,936,164 →
Application: 08/917,974 →
One-Time Programmable Latch Which Allows Volatile Writes Prior to Permanent Programming
Patent: 5,856,941 →
Application: 08/929,457 →
Silicon Force and Displacement Sensor
Patent: 5,915,281 →
Application: 08/942,840 →
Method of Making a Thick Film Pressure Sensor
Patent: 5,867,886 →
Application: 08/954,266 →
Thick Film Circuit Having Improved Conductor Compositon with Coated Metallic Particles
Patent: 5,928,568 →
Application: 08/954,385 →
Audio Amplifier Having Linear Gain Control
Patent: 5,936,470 →
Application: 08/987,958 →
Method of Manufacture for a Thick Film Multi-Layer Circuit
Patent: 5,910,334 →
Application: 08/991,685 →
Diffusion-Barrier Materials for Thick-Film Piezoresistors and Sensors Formed Therewith
Patent: 5,898,359 →
Application: 08/994,113 →
Distributed Digital Radio System
Patent: 6,078,622 →
Application: 08/995,924 →
Flip Chip-on-Flip Chip Multi-Chip Module
Patent: 5,914,535 →
Application: 09/008,457 →
Deployment Control Method for Distributed Architecture Supplemental Inflatable Restraint System
Patent: 5,899,949 →
Application: 09/012,974 →
Address Communication Method for a Distributed Architecture Supplemental Inflatable Restraint System
Patent: 5,964,816 →
Application: 09/012,976 →
Method of Simultaneously Attaching Surface-Mount and Chip-on-Board Dies to a Circuit Board
Patent: 6,071,371 →
Application: 09/016,908 →
Encapsulation Method for Fine-Pitch Chip-On-Board
Patent: 5,930,604 →
Application: 09/017,435 →
Sensor with Silicon Strain Gage
Patent: 5,932,809 →
Application: 09/024,379 →
Process for Producing Flip Chip Circuit Board Assembly Exhibiting Enhanced Reliability
Patent: 5,953,814 →
Application: 09/032,148 →
Semiconductor Substrate Subassembly with Alignment and Stress Relief Features
Patent: 6,127,727 →
Application: 09/055,679 →
Method for Removing Heat from a Flip Chip Semiconductor Device
Patent: 6,180,436 →
Application: 09/072,593 →
Fault Tolerant Power Supply and Bus Topology for a Distributed Architechure Supplemental Restraint System
Patent: 6,046,511 →
Application: 09/075,469 →
Flip Chip on Circuit Board with Enhanced Heat Dissipation and Method Therefor
Patent: 6,156,980 →
Application: 09/090,495 →
Integrated Circuit Assembly for Power and Electronics
Patent: 6,011,319 →
Application: 09/093,992 →
Process for Verifying a Hermetic Seal and Semiconductor Device Therefor
Patent: 6,074,891 →
Application: 09/098,291 →
Method of Manufacturing a Thick Film Circuit with Improved Dielectric Feature Definition
Patent: 6,007,867 →
Application: 09/106,788 →
Intgrated Differential Voltage Amplifier with Programmable Gain and Input Offset Voltage
Patent: 6,011,422 →
Application: 09/113,525 →
Process for Structurally Securing Stick-Leaded Components to a Circuit Board
Patent: 6,012,223 →
Application: 09/127,290 →
Through Hole Circuit Board Interconnect
Patent: 6,081,996 →
Application: 09/177,586 →
Method of Forming Ruthenium-Based Thick-Film Resistors
Patent: 6,180,164 →
Application: 09/178,758 →
Restraint Deployment Control Method Having a Delayed Adaptable Deployment Threshold
Patent: 6,219,606 →
Application: 09/192,523 →
Circuit Board Assembly with Ic Device Mounted Thereto
Patent: 6,154,364 →
Application: 09/197,093 →
Flip Chip Solder Bump Pad
Patent: 6,180,265 →
Application: 09/216,769 →
Smart Ic Power Control
Patent: 5,982,158 →
Application: 09/293,892 →
Vehicle Audio System Having Random Access Player with Play List Control
Patent: 6,185,163 →
Application: 09/374,305 →
Frontal Impact Characterization Apparatus for a Motor Vehicle Restraint System
Patent: 6,559,763 →
Application: 09/840,553 →
Publication: US 2002/0154006
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Release of Security Agreement Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Assignment of Assignor's Interest Dec 11, 2008
From: DELPHI TECHNOLOGIES, INC.
To: BEWES ASSETS LIMITED LIABILITY COMPANY
Reel/Frame 021965/0951 →
Chain of Title Apr 16, 2009
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 022552/0482 →
Assignment of Assignor's Interest Jul 30, 2009
From: DELPHI TECHNOLOGIES, INC.
To: CASANTRA ACQUISTION III LLC
Reel/Frame 023015/0720 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 023015 Frame 0720. Assignor(S) Hereby Confirms the Corrective Assignment to Correct the Assignee Name from Casantra Acquistion Iii Llc to Casantra Acquisition Iii Llc. Aug 18, 2009
From: DELPHI TECHNOLOGIES, INC.
To: CASANTRA ACQUISITION III LLC
Reel/Frame 023107/0581 →
Assignment of Assignor's Interest Aug 19, 2009
From: PALANISAMY, PONNUSAMY
To: GENERAL MOTORS CORPORATION
Reel/Frame 023119/0037 →
Assignment of Assignor's Interest Sep 12, 2011
From: DELPHI TECHNOLOGIES, INC.
To: GOOGLE INC.
Reel/Frame 026885/0288 →
Assignment of Assignor's Interest Dec 19, 2012
From: DELPHI TECHNOLOGIES, INC.
To: RAMBUS INTERNATIONAL LTD.
Reel/Frame 029499/0434 →
Assignment of Assignor's Interest Mar 11, 2013
From: RAMBUS INC.
To: RAMBUS DELAWARE
Reel/Frame 029967/0165 →
Assignment of Assignor's Interest Mar 11, 2013
From: RAMBUS INTERNATIONAL LTD.
To: RAMBUS INC.
Reel/Frame 029960/0421 →
Assignment of Assignor's Interest Oct 1, 2014
From: RAMBUS INTERNATIONAL LTD.
To: RAMBUS DELAWARE LLC
Reel/Frame 033881/0001 →
Change of Name Oct 6, 2017
From: GOOGLE INC.
To: GOOGLE LLC
Reel/Frame 044144/0001 →
Corrective Assignment to Correct the the Removal of the Incorrectly Recorded Application Numbers 14/149802 and 15/419313 Previously Recorded at Reel: 44144 Frame: 1. Assignor(S) Hereby Confirms the Change of Name. Mar 4, 2024
From: GOOGLE INC.
To: GOOGLE LLC
Reel/Frame 068092/0502 →