Patent Assignment
Reel/Frame 023015/0720
Assignment of Assignor's Interest
Recorded: 2009-07-30
Pages: 12
Assignor
DELPHI TECHNOLOGIES, INC.
Executed: 2009-05-15
Assignee
CASANTRA ACQUISTION III LLC
160 GREENTREE DRIVE, SUITE 101, DOVER, DELAWARE, 19904
Covered Properties
(28)
Post-Termination Apparatus and Process for Thick Film Resistors of Printed Circuit Boards
Patent:
5,169,679 →
Application:
07/256,017 →
Integrated Circuit Heat Sink
Application:
07/318,389 →
An Interface Device for Thermally Coupling an Integrated Circuit to a Heat Sink
Patent:
5,151,777 →
Application:
07/422,395 →
Post-Termination Apparatus and Process for Thick Film Resistors of Printed Circuit Boards
Patent:
5,164,698 →
Application:
07/724,011 →
Ultra-Thick Thick Films for Thermal Management and Current Carrying Capabilities in Hybrid Circuits
Patent:
5,395,679 →
Application:
08/038,379 →
Thick Film Rotational Accelerometer Having Two Structurally Integrated Acceleration Sensors
Patent:
5,456,109 →
Application:
08/038,422 →
Ink Composition for an Ultra-Thick Thick Film for Thermal Management of a Hybrid Circuit
Patent:
5,527,627 →
Application:
08/342,966 →
Multilayer Conductor for Printed Circuits
Patent:
5,527,999 →
Application:
08/391,740 →
Segmented Thick Film Resistors
Patent:
5,621,240 →
Application:
08/523,580 →
Thick-Film Conductor Compositions Comprising Silver or Palladium Particles Coated with Alumina or Zirconia
Patent:
5,716,552 →
Application:
08/668,900 →
Method for Controlling Solder Bump Shape and Stand-Off Height
Patent:
5,926,731 →
Application:
08/887,064 →
Method of Making a Thick Film Pressure Sensor
Patent:
5,867,886 →
Application:
08/954,266 →
Thick Film Circuit Having Improved Conductor Compositon with Coated Metallic Particles
Patent:
5,928,568 →
Application:
08/954,385 →
Method for Controlling Solderability of a Conductor and Conductor Formed Thereby
Patent:
5,962,151 →
Application:
08/985,436 →
Method of Manufacture for a Thick Film Multi-Layer Circuit
Patent:
5,910,334 →
Application:
08/991,685 →
Diffusion-Barrier Materials for Thick-Film Piezoresistors and Sensors Formed Therewith
Patent:
5,898,359 →
Application:
08/994,113 →
Strain Gauge with Steel Substrate
Patent:
5,959,214 →
Application:
08/995,801 →
Solder Stop for an Electrical Connection and Method Therefor
Patent:
6,531,663 →
Application:
09/016,504 →
Method of Manufacturing a Thick Film Circuit with Improved Dielectric Feature Definition
Patent:
6,007,867 →
Application:
09/106,788 →
Metal Diaphragm Sensor with Polysilicon Sensing Elements and Methods Therefor
Patent:
6,022,756 →
Application:
09/127,291 →
Method of Forming Ruthenium-Based Thick-Film Resistors
Patent:
6,180,164 →
Application:
09/178,758 →
Method of Forming Thick-Film Hybrid Circuit on a Metal Circuit Board
Patent:
6,233,817 →
Application:
09/232,951 →
Thick-Film Paste with Insoluble Additive
Patent:
6,328,914 →
Application:
09/240,084 →
Thick-Film Circuits and Metallization Process
Patent:
6,150,041 →
Application:
09/344,046 →
Method for Controlling Solderability of a Conductor and Conductor Formed Thereby
Patent:
6,391,678 →
Application:
09/344,971 →
Method of Manufacturing a Thick Film Circuit with Constrained Adhesive Spreading
Patent:
6,164,522 →
Application:
09/384,892 →
High Current Circuit Trace and Composition and Method Therefor
Patent:
6,221,514 →
Application:
09/385,051 →
MULTI-LAYER CONDUCTOR PAD FOR REDUCING SOLDER Voiding
Patent:
6,362,435 →
Application:
09/467,500 →
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2004
From: DELCO ELECTRONICS LLC
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 015478/0426 →
Assignment of Assignor's Interest
Jul 5, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 016700/0623 →
Security Agreement
Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →
Assignment of Assignor's Interest
Sep 30, 2005
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES INC.
Reel/Frame 017115/0208 →
Release of Security Agreement
Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
Release of Security Agreement
Apr 28, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020886/0221 →
Chain of Title
Apr 16, 2009
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 022552/0482 →
Corrective Assignment to Correct the Serial No. 08/994113 and Filing Date 19-Dec-97 of the Conveyed Application. Previously Recorded on Reel 009202 Frame 0796. Assignor(S) Hereby Confirms the Assignment of the Entire Right, Title and Interest.
Jun 4, 2009
From: ELLIS, MARION E.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 022783/0028 →
Corrective Assignment to Correct the Serial No. 09/127291 and Filing Date 31-Jul-98 of the Conveyed Application. Previously Recorded on Reel 009457 Frame 0818. Assignor(S) Hereby Confirms the Assignment of the Entire Right, Title and Interest..
Jun 4, 2009
From: SPARKS, DOUGLAS R.; VIDUYA, ANDRES D.; LITTLE, LEWIS H.; ELLIS, MARION E.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 022773/0975 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 023015 Frame 0720. Assignor(S) Hereby Confirms the Corrective Assignment to Correct the Assignee Name from Casantra Acquistion Iii Llc to Casantra Acquisition Iii Llc.
Aug 18, 2009
From: DELPHI TECHNOLOGIES, INC.
To: CASANTRA ACQUISITION III LLC
Reel/Frame 023107/0581 →
Assignment of Assignor's Interest
Aug 19, 2009
From: PALANISAMY, PONNUSAMY
To: GENERAL MOTORS CORPORATION
Reel/Frame 023119/0037 →
Merger
Jan 14, 2016
From: CASANTRA ACQUISITION III LLC
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037520/0962 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Jan 28, 2020
From: CALLAHAN CELLULAR L.L.C.
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051727/0155 →