Granted Patent
Utility
US 5,461,008 · App. 08/249,815
Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers
Inventors:
Richard M. Sutherland, Howard E. Harrell, Wayne Anthony Sozansky, George C. Wolf
Patented Case
View Patent ↗
Granted: Oct 24, 1995
Filed: May 26, 1994
Inventors
Richard M. Sutherland
Howard E. Harrell
Wayne Anthony Sozansky
George C. Wolf
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.