Granted Patent
Utility
US 5,891,756 · App. 08/883,694
Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby
Inventor:
Curt A Erickson
Patented Case
View Patent ↗
Granted: Apr 6, 1999
Filed: Jun 27, 1997
Inventor
Curt A Erickson
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.