Patent Assignment
Reel/Frame 011139/0240
Assignment of Assignor's Interest
Recorded: 2000-09-22
Pages: 4
Assignee
FLIP CHIP TECHNOLOGIES, L.L.C.
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Polymer Collar for Solder Bumps
Patent:
6,578,755 →
Application:
09/668,450 →
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 19, 2004
From: FLIP CHIP TECHNOLOGIES, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 014990/0037 →
Security Agreement
Mar 1, 2004
From: FLIPCHIP INTERNATIONAL LLC
To: KULICKE & SOFFA INDUSTRIES, INC.
Reel/Frame 015017/0171 →
Change of Address
Oct 27, 2004
From: FLIPCHIP INTERNATIONAL, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 015293/0274 →
Release of Security Interest
Oct 10, 2005
From: KULICKE AND SOFFA INDUSTRIES, INC.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 016630/0226 →
Security Agreement
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0850 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Amended and Restated License Agreement
May 8, 2008
From: FLIPCHIP INTERNATIONAL LLC
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 020930/0057 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest
Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →