Patent Assignment
Reel/Frame 008862/0068
Assignment of Assignor's Interest
Recorded: 1997-10-20
Pages: 4
Assignee
FLIP CHIP TECHNOLOGIES, L.L.C.
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Chip Scale Package Using Large Ductile Solder Balls
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 19, 2004
From: FLIP CHIP TECHNOLOGIES, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 014990/0037 →
Security Agreement
Mar 1, 2004
From: FLIPCHIP INTERNATIONAL LLC
To: KULICKE & SOFFA INDUSTRIES, INC.
Reel/Frame 015017/0171 →
Change of Address
Oct 27, 2004
From: FLIPCHIP INTERNATIONAL, LLC
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 015293/0274 →
Release of Security Interest
Oct 10, 2005
From: KULICKE AND SOFFA INDUSTRIES, INC.
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 016630/0226 →
Security Agreement
Oct 13, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 016630/0850 →
Ack of Intel. Prop. Collateral Lien
Nov 1, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017186/0714 →
Ack of Intel. Prop. Collateral Lien
Nov 8, 2005
From: FLIPCHIP INTERNATIONAL, LLC
To: CAPITALSOURCE FINANCE LLC
Reel/Frame 017207/0305 →
Amended and Restated License Agreement
May 8, 2008
From: FLIPCHIP INTERNATIONAL LLC
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 020930/0057 →
Release of Security Interest
Aug 26, 2009
From: CAPITALSOURCE FINANCE LLC
To: FLIPCHIP INTERNATIONAL LLC
Reel/Frame 023134/0869 →
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest
Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →