Patent Assignment
Reel/Frame 015009/0229
Assignment of Assignor's Interest
Recorded: 2004-02-19
Pages: 2
Assignors
INAGAKI, YASUSHI
Executed: 2001-03-22
ASAI, MOTOO
Executed: 2001-03-22
WANG, DONGDONG
Executed: 2001-03-22
YABASHI, HIDEO
Executed: 2001-03-22
SHIRAI, SEIJI
Executed: 2001-03-22
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU 503-0917, JAPAN
Covered Property
(1)
Printed Circuit Board and Method of Manufacturing Printed Circuit Board