Patent Assignment
Reel/Frame 015021/0315
Assignment of Assignor's Interest
Recorded: 2004-02-26
Pages: 2
Assignor
KIM, YE-YONG
Executed: 2004-02-10
Assignee
LG ELECTRONICS, INC.
20, YOIDO-DONG, YOUNGDUNGPO-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Dissipating Structure for Mobile Device