IP Library Assignment 015030/0472
Patent Assignment
Reel/Frame 015030/0472

Assignment of Assignor's Interest

Recorded: 2004-02-26 Pages: 3
Assignors
MAEKAWA, TSUTOMU
Executed: 2004-02-16
OUCHI, AKEMI
Executed: 2004-02-16
FUJII, HIDETOSHI
Executed: 2004-02-16
TAMAHASHI, KUNIHIRO
Executed: 2004-02-16
SHOJI, YUTAKA
Executed: 2004-02-16
TAKAHAGI, HIROSHI
Executed: 2004-02-16
Assignee
HITACHI PRINTING SOLUTIONS, LTD.
NO. 15-1, KONAN 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Three-Dimensional Laminating Molding Device
Patent: 7,104,773 →
Application: 10/785,954 →
Publication: US 2004/0175451
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 18, 2005
From: HITACHI PRINTING SOLUTIONS, LTD.
To: RICOH PRINTING SYSTEMS, LTD.
Reel/Frame 016855/0692 →