IP Library Granted Patent US 7,104,773
Granted Patent B2
US 7,104,773 · App. 10/785,954 · Granted Sep 12, 2006

Three-dimensional laminating molding device

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Quick Facts
Patent No.
US 7,104,773
App. No.
10/785,954
Granted
Sep 12, 2006
Kind
B2
Abstract

A three-dimensional laminating molding device includes ejection heads that eject support material for a support, and an ejection head that ejects mold material for a mold. The support material is sold at room temperature. An inner temperature of the laminating molding device during the laminating molding is controlled to a range of (a melting point of the support material−30)° C. to (the melting point of the support material−5)° C.

Claims (31)

1. A three-dimensional laminating molding device comprising:

a first ejecting unit that ejects a support material so as to form a support layer for burying a mold, the support material having a melting point;

a second ejecting unit that ejects a mold material for a mold;

a casing that houses the first and second ejecting units; and

a controller that controls an inner temperature of the casing to a range from a temperature 30° C. lower than the melting point to a temperature 5° C. lower than the melting point.

2. A three-dimensional laminating molding device, comprising:

a support material;

a mold material that is an active-energy-ray curing compound;

a first ejecting unit that ejects said support material so as to form a support layer for burying a mold, the support material having a melting point;

a second ejecting unit that ejects said mold material for a mold;

a casing that houses the first and second ejecting units; and

a controller that controls an inner temperature of the casing to a range from a temperature 30° C. lower than the melting point to a temperature 5° C. lower than the melting point.

3. The three-dimensional laminating molding device according to claim 2 , wherein the support material is a material that melts when irradiated with an active energy ray.

4. The three-dimensional laminating molding device according to claim 2 , wherein the support material is a material that deforms when irradiated with an active energy ray.

5. A three-dimensional lamination device, comprising:

a support material and a mold material, wherein the support material and mold material have different colors;

a first ejecting unit that ejects a support material so as to form a support layer for burying a mold, the support material having a melting point;

a second ejecting unit that ejects a mold material for a mold;

a casing that houses the first and second ejecting units; and

a controller that controls an inner temperature of the casing to a range from a temperature 30° C. lower than the melting point to a temperature 5° C. lower than the melting point.

6. The three-dimensional lamination device according to claim 5 , wherein the support material contains a colorant.

7. The three-dimensional lamination device according to claim 6 , wherein the support material is added with one of a black dye, a black pigment, a dark-colored dye, and a dark-colored pigment.

8. The three-dimensional laminating molding device according to claim 1 , further comprising an irradiation device that irradiates an active energy ray, wherein the irradiation device is disposed adjacent to the first ejection head.

9. The three-dimensional laminating molding device according to claim 1 , further comprising a pair of irradiation devices that irradiate active energy rays, wherein the pair of irradiation devices are adjacent the first and second ejection units.

10. A three-dimensional laminating molding device comprising:

a support material that is solid at room temperature;

a mold material that is liquid at room temperature;

a first ejecting unit that ejects said support material so as to form a support layer for burying a mold, the support material having a melting point;

a second ejecting unit that ejects said mold material for a mold;

a casing that houses the first and second ejecting units; and

a controller that controls an inner temperature of the casing to a range from 30° C. lower than the melting point to a temperature 5° 0 C. lower than the melting point.

Assignments (2)
CHANGE OF NAME Recorded Feb 18, 2005
From: HITACHI PRINTING SOLUTIONS, LTD.
To: RICOH PRINTING SYSTEMS, LTD.
Reel/Frame 016855/0692 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2004
From: MAEKAWA, TSUTOMU; OUCHI, AKEMI; FUJII, HIDETOSHI; TAMAHASHI, KUNIHIRO; SHOJI, YUTAKA; TAKAHAGI, HIROSHI
To: HITACHI PRINTING SOLUTIONS, LTD.
Reel/Frame 015030/0472 →