Patent Assignment
Reel/Frame 015031/0023
Assignment of Assignor's Interest
Recorded: 2004-02-25
Pages: 3
Assignors
CHEN, NENG-KUO
Executed: 2004-02-17
CHU, HSIU-CHUAN
Executed: 2004-02-17
HUANG, CHIH-AN
Executed: 2004-02-17
LU, HSIAO-KING
Executed: 2004-02-17
TSAI, TENG-CHUN
Executed: 2004-02-17
Assignee
UNITED MICROELECTRONICS CORP
NO. 3, LI-HSIN RD. II, SCIENCE-BASED, INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Method for Forming Shallow Trench Isolation Structure
Patent:
6,913,978 →
Application:
10/788,183 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.