Patent Assignment
Reel/Frame 015031/0351
Assignment of Assignor's Interest
Recorded: 2004-02-27
Pages: 2
Assignors
KURIMOTO, HIDEYUKI
Executed: 2004-02-09
DOTTA, YOSHIHISA
Executed: 2004-02-10
KIMURA, TOSHIO
Executed: 2004-02-10
Assignee
SHARP KABUSHIKI KAISHA
22-22 NAGAIKE-CHO, ABENO-KU, OSAKA, 545-8522, JAPAN
Covered Property
(1)
Fabrication Method of Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 14, 2013
From: SHARP KABUSHIKI KAISHA
To: INVENSAS CORPORATION
Reel/Frame 031401/0219 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →