Patent Assignment
Reel/Frame 015034/0707
Assignment of Assignor's Interest
Recorded: 2004-02-27
Pages: 3
Assignors
CHEN, KEI-WEI
Executed: 2003-11-19
TSAO, JUNG-CHIH
Executed: 2003-11-19
LIU, CHI-WEN
Executed: 2003-11-19
CHEN, JCHUNG-CHANG
Executed: 2003-11-19
CHANG, SHIH-TZUNG
Executed: 2003-11-19
LIN, SHIH-HO
Executed: 2003-11-19
YU-KU-LIN
Executed: 2003-11-19
WANG, YING-LANG
Executed: 2003-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8 LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Method of Forming Barrier Layer with Reduced Resistivity and Improved Reliability in Copper Damascene Process