Patent Assignment
Reel/Frame 015041/0316
Assignment of Assignor's Interest
Recorded: 2004-03-08
Received: 2004-03-10
Pages: 6
Assignors
CHIU, SAO-LING
Executed: 2004-02-18
JAN, JONG-RONG
Executed: 2004-02-18
KUNG, LING-CHEN
Executed: 2004-02-18
LU, TSAI-HUA
Executed: 2004-02-18
Assignee
UNITIVE ELECTRONICS INC.
140 SOUTHCENTER COURT, MORRISVILLE, NC, 27560, UNITED STATES
Covered Property
(1)
Selective bumping - a process for bumping wafers with exposed metal layers
Application:
60/448,096 →