IP Library › Patent Application 60448096
Patent Application Provisional
App. No. 60/448,096 · Confirmation No. 2555

Selective bumping - a process for bumping wafers with exposed metal layers

Provisional Application Expired
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 Code Description Pages PDF
2003-02-18 TRNA Transmittal of New Application 2 View
2003-02-18 SPEC Specification 4 View
2003-02-18 CLM Claims 2 View
2003-02-18 DRW Drawings-only black and white line drawings 2 View
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Quick Facts
App. No.
60/448,096
Filed
2003-02-18