Assignment of Assignor's Interest

Recorded: 2006-06-23 Received: 2006-06-23 Pages: 5

Assignor

UNITIVE ELECTRONICS INC.

Executed: 2006-06-14

Assignee

UNITIVE INTERNATIONAL LIMITED

CARACASBAAIWEG 201, CURACAO, ANX, NETHERLANDS ANTILLES

Covered Properties (7)

Optical Structures Including Liquid Bumps and Related Methods

Application: 11/213,414 →

Electronic Devices Including Metallurgy Structures for Wire and Solder Bonding

Application: 10/837,830 →

Methods of Selectively Bumping Integrated Circuit Substrates and Related Structures

Application: 10/780,529 →

Selective bumping - a process for bumping wafers with exposed metal layers

Application: 60/448,096 →

Methods of Positioning Components Using Liquid Prime Movers and Related Structures

Application: 10/008,466 →

Methods and Systems for Positioning Substrates Using Spring Force of Phase-Changeable Bumps Therebetween

Application: 10/016,270 →

Methods of Forming Metallurgy Structures for Wire and Solder Bonding

Application: 09/966,316 →