Optical structures including liquid bumps and related methods
View Patent ↗A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.
1. A method of manipulating a light path between two optical components, the method comprising:
providing a liquid material on a wettable area of a substrate so that the liquid material forms a bump on the wettable area; and
changing a height of the liquid bump between a first height and a second height so that the liquid bump interrupts the light path at the first height of the liquid bump and so that the light path is not interrupted at the second height of the liquid bump.
2. A method according to claim 1 wherein changing a height of the liquid bump comprises differentially heating the liquid bump.
3. A method according to claim 1 wherein the wettable area of the substrate comprises first and second portions of different dimensions and wherein changing a height of The liquid bump comprises changing temperatures of the liquid on the first and second portions from a first common temperature to a second common temperature.
4. A method according to claim 1 wherein the wettable area of the substrate comprises first and second portions and wherein changing a height of the liquid bump comprises moving portions of the liquid from the first portion of the wettable area to the second portion of the wettable area.
5. A method according to claim 4 wherein the first and second portions of the wettable area are coupled by a wettable channel that is narrow with respect to the first and second portions of the wettable area.
6. A method according to claim 5 wherein moving portions of the liquid comprises differentially heating the first and second portions of the wettable area.
7. A method according to claim 1 wherein the wettable area of the substrate comprises first and second portions of different dimensions and wherein changing a height of the liquid bump comprises changing an electrical potential of the liquid on the first and second portions from a first common potential to a second common potential.
8. A method according to claim 1 wherein the wettable area is a wettable surface area of the substrate and wherein the liquid bump protrudes away from the substrate at the first and second heights.