Patent Assignment
Reel/Frame 015051/0178
Assignment of Assignor's Interest
Recorded: 2004-03-03
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Multi-Layer Interconnection Structure and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.