Patent Assignment
Reel/Frame 015052/0727
Assignment of Assignor's Interest
Recorded: 2004-02-26
Pages: 3
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD, RD., 811, NANTZE EXPORT, PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Flip-Chip Package and Fabricating Process Thereof