IP Library › Assignment 015059/0200
Patent Assignment
Reel/Frame 015059/0200

Assignment of Assignor's Interest

Recorded: 2004-03-05 Pages: 8
Assignors
GUARINI, KATHRYN W.
Executed: 2004-01-13
HSU, LOUIS L.
Executed: 2004-01-14
SHI, LEATHEN
Executed: 2004-02-11
SINGH, DINKAR V.
Executed: 2004-02-11
WANG, LI-KONG
Executed: 2004-02-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method of Fabricating Silicon Devices on Sapphire with Wafer Bonding at Low Temperature
Patent: 6,911,375 →
Application: 10/452,715 →
Publication: US 2004/0241958
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 2, 2003
From: GUARINI, KATHRYN W.; HSU, LOUIS L.; SHI, LEATHEN; SINGH, DINKAR V.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014150/0987 →